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Viasion technology company
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1 OZ Immersion Gold 4 Layer Multilayer PCB For Splitters And Combiners
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
1 OZ Immersion Gold 4 Layer Multilayer PCB For Sp
1 OZ Immersion Gold 4 Layer Multilayer PCB For Splitters And Combiners
Specification:
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Material |
FR4 TG135 |
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Layer count |
4 layers |
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Board thickness |
1.6mm |
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Copper thickness |
1oz |
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Minimum drill size |
0.2mm |
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Minimum trace & gap |
0.1mm |
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Surface finish |
Immersion gold |
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Applications |
Splitters and combiners |
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Special Technology |
NO |
PCB Circuit Board
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NO |
ITEM |
Technical capabilities |
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1 |
Layers |
1-20 layers |
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2 |
Max. Board size |
508×610 mm |
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3 |
Min. board Thickness |
2-layer 0.12mm |
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4-layer 0.4mm |
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6-layer 0.6mm |
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8-layer 0.90mm |
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10-layer 1mm |
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4 |
Min. line Width/Space |
0.127mm(4mil) |
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5 |
Max. Copper thickness |
5OZ |
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6 |
Min. S/M Pitch |
0.075mm(3mil) |
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7 |
Min. hole size |
0.15mm(6mil) |
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8 |
Hole dia. Tolerance (PTH) |
±0.05mm(2mil) |
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9 |
Hole dia. Tolerance (NPTH) Related Search
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