Viasion technology company
|
Place of Origin: | Zhejiang, China (Mainland) |
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Green Solder Mask 12 Layer Immersion Silver PCB FR4 High TG , HDI Board With Laser Drill
Specifications:
Material |
FR4 High TG |
Layer count |
12 layers |
Board thickness |
1.6mm |
Copper thickness |
Inner layer 0.5oz, out layer 1oz |
Minimum drill size |
0.1mm |
Minimum trace & gap |
0.075mm |
Surface finish |
Immersion silver |
Applications |
Communication |
Special Technology |
HDI board with laser drill |
|
Blind vias: 1-2, 11-12, buried vias: 2-11 |
PCB Circuit Board
NO |
ITEM |
Technical capabilities |
1 |
Layers |
1-20 layers |
2 |
Max. Board size |
508×610 mm |
3 |
Min. board Thickness |
2-layer 0.12mm |
4-layer 0.4mm |
||
6-layer 0.6mm |
||
8-layer 0.90mm |
||
10-layer 1mm |
||
4 |
Min. line Width/Space |
0.127mm(4mil) |
5 |
Max. Copper thickness |
5OZ |
6 |
Min. S/M Pitch |
0.075mm(3mil) |
7 |
Min. hole size |
0.15mm(6mil) |
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